What are the applications of online defect detectors in the electronic manufacturing industry

Source：www.uninorths.com.cn Release date： 2025-07-22

Online defect detectors have become a key equipment for ensuring product quality in the electronic manufacturing industry due to their high-precision detection capabilities. They are widely used in the production process of various electronic components, assemblies, and finished products. The following are its main application scenarios and functions:
1、 Semiconductor and chip manufacturing
Wafer inspection: Detecting scratches, dents, particle contamination, photolithography pattern defects (such as line breakage, deformation) on the surface of the wafer to avoid defects affecting the circuit performance of subsequent chips.
Chip packaging inspection: Check for cracks, bubbles, pin deformations (such as bending, missing, oxidation), pad contamination, etc. in the chip packaging shell to ensure stable electrical connections of the packaged chip.
Integrated Circuit (IC) Testing: Through optical or image recognition technology, micro defects such as short circuits, open circuits, and bridge connections in the internal circuits of ICs are identified to ensure the normal functioning of circuit logic.
2、 PCB (Printed Circuit Board) Manufacturing
Line layer detection: detect etching defects (such as wire breakage, short circuit, line width deviation, burrs), solder mask bubbles, exposed copper, scratches, etc. on the PCB board to avoid circuit conduction faults.
Drilling and hole diameter detection: Check the position deviation, inconsistent hole size, rough hole wall, foreign objects inside the hole, etc. of PCB drilling to ensure the correctness of subsequent component soldering or insertion.
Surface mount (SMT) pre installation inspection: Before component installation, inspect PCB pads for oxidation, contamination, offset, and other issues to reduce installation defects (such as virtual soldering and false soldering).
3、 Production of electronic components
1. Passive component testing:
Resistors, capacitors, and inductors: detect appearance defects (such as damaged shells, corroded pins, blurred markings), dimensional deviations, electrode detachment, etc.
Diode and transistor: Check for bent pins, packaging cracks, etc. to avoid affecting electrical performance.
2. Connector testing: Detect the deformation (bending, misalignment), surface scratches, coating defects (peeling, exposed bottom), insulation cracking, etc. of the pins/sockets of the connector to ensure the reliability and conductivity of insertion and extraction.
4、 Manufacturing of display screens and touch panels
1. LCD/OLED panel inspection:
Glass substrate inspection: Identify scratches, bubbles, impurities, rainbow patterns, etc. on the surface of the substrate to avoid affecting the display effect.
Display area detection: Detect bright spots, dark spots, line defects (vertical and horizontal lines), light leakage, residual images, and uneven colors within the screen to ensure display quality.
2. Touch screen detection: Check for broken wires, short circuits, scratches on the ITO film layer, edge warping, etc. in the touch layer to ensure touch sensitivity and accuracy.
5、 Assembly of terminal products such as mobile phones and computers
Shell and structural component inspection: Detect scratches, dents, color differences, injection molding defects (such as shrinkage marks, flying edges), logo printing offset/blur and other appearance issues of mobile phone/computer shells (metal, glass, plastic).
Screen assembly inspection: Check the fit gap, bubbles, and misalignment between the screen and the middle frame, scratches and stains on the camera lens, and misalignment of button assembly.
Internal component inspection: Through automated optical inspection (AOI) or X-ray inspection, check for hidden defects such as virtual soldering in battery welding, damaged wiring, and missing/loose screws.

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